Implementation study of an intelligent system for IC transfer molding process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2644, Issue , 1996, Pages 471-476

  Yeung, T S ^a   Yuen, M M ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

TRANSFER MOLDING MACHINES;

ARTIFICIAL INTELLIGENCE; COMPUTER AIDED DESIGN; ENCAPSULATION; MOLDING; MOLDS; OPTIMIZATION; PLASTICS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029722242     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)