Overmold technology applied to cavity down ultrafine pitch PBGA package

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 2, 1999, Pages 123-128

  Ouimet, Sylvain ^a   Paquet, Marie Claude ^a  

^a IBM CANADA LTD   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; PROCESS ENGINEERING; TRANSFER MOLDING;

CHIP-UP PLASTIC BALL GRID ARRAY PACKAGES; ULTRAFINE PITCH WIREBOND PROCESS;

ELECTRONICS PACKAGING;

EID: 0033310248     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.763182     Document Type: Article

References (5)

1. L. Boutin"Transfer molding of IBM cavity down PBGA package," in Proc. Int. Flip Chip, Ball Grid Array, Tab Adv. Packag. Symp. (ITAP'97), Sunnyvale, CA, Feb. 18-19, 1997. ;
2. M. J. Kuzawinski and K. J. Blackwell"Ultra fine pitch wire bond ;S PBGA's," Electron. Packag. Prod., vol. 37, no. 12, pp. 56-62, Sept. :? 1997
3. EM Version 3.0 User's Guide. MontrealP.Q.: ÉTS, 1995.
4. M. C. Paquet"Molding challenges of LOG packages with large de- S vices," in Proc. 47th Electron. Comp. Technol. Conf. (ECTC'97), San Jose, CA, May 18-21, 1997
5. M. GalopinT. M. Dao, and L. Lamarche, "An integrated computeraided optimization system for process planning," in IFAC Workshop Intell. Manufact. Syst., R. P. Judd and N. A. Kheir, Eds. New York: Pergamon, 1992, pp. 141-146.