Effects of the aluminum filler content on moisture diffusion into epoxy adhesives in distilled water and sea water

Journal of Applied Polymer Science

Volumn 98, Issue 3, 2005, Pages 1165-1171

  Kahraman, Ramazan ^a  

^a KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS   (Saudi Arabia)

Author keywords

Adhesives; Diffusion; Fillers

Indexed keywords

ADHESIVES; ALUMINUM; DIFFUSION; MOISTURE;

ALUMINIUM FILLERS; METAL FILLERS; THERMAL PROPERTIES;

FILLERS;

ADHESIVE AGENT;

EID: 27744594780     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.22122     Document Type: Article

References (33)

1. Kozma, L.; Olefjord, I. Mater Sci Technol 1987, 3, 860.
2. Eagland, D. CHEMTECH 1990, 248.
3. Watson, C. Engineering 1987, 1.
4. Tai, R. C. L; Szklarska-Smialowska, Z. J Mater Sci 1993, 28, 6199.
5. Chasser, A. M.; Makhlouf, J. M.; Schneider, J. R. Adhes Age 1993, 36.
6. Dixon, D. G.; Harris, S. J.; Dempster, M.; Nicholls, P. J Adhes 1998, 65, 131.
7. Brewis, D. M. Continuous Casting '85, Proceedings of the International Conference Sponsored and Organized by the Institute of Metals, London, England, 1985; p 629.
8. Mohan, R. Plast Eng 1990, 47.
9. Hermansen, R. D.; Tunick, S. A. Adhes Age 1989, 38.
10. Tomlinson, W. J.; Stapley, D. J Mater Sci Lett 1977, 12, 1689.
11. Lee, H.; Neville, K. Handbook of Epoxy Resins; McGraw-Hill: New York, 1967.
12. Kingery, W. D. Introduction to Ceramics; Wiley: New York, 1960.
13. Nieberlein, V. A.; Steverding, B. J Mater Sci Lett 1977, 12, 1685.
14. Gaynes, M. A.; Matienzo, L. J.; Zimmerman, J. A.; Vanchart, D. Electronic Packaging Materials Science; Materials Research Society Symposium Proceedings IX; Materials Research Society: Warrendale, PA, 1997; p 139.
15. Hahn, O.; Meschut, G.; Koyro, M. Schweissen Schneiden 1998, 50, E130.
16. Subramanian, S.; Kustas, F.; Rawal, S.; Shinn, E. T. Collection of Technical Papers, AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics & Materials Conference 3, Reston, VA, 1998; p 2423.
17. Nikkeshi, S.; Kudo, M.; Masuko, T. J Appl Polym Sci 1998, 69, 2593.
18. Kang, S.; Purushothaman, S. Proceedings of the Electronic Components and Technology Conference, Piscataway, NJ, 1998; p 1031.
19. Lu, D.; Tong, Q. K.; Wong, C. P. IEEE Trans Electron Packaging Manufacturing 1999, 22, 223.
20. Kinloch, A. J. Durability of Structural Adhesives; Applied Science: London, 1983.
21. Shaffer, D. K.; Davis, G. D.; McNamara, D. K.; Shah, T. K.; Desai, A. International SAMPE Metals and Metals Processing Conference, Covina, CA, 1992; Vol. 3, p 629.
22. Brewer, D. Master's Thesis, Case Western Reserve University, 1988.
23. Tai, R. C. L.; Szklarska-Smialowska, Z. J Mater Sci 1993, 28, 6205.
24. Prakash, R.; Srivastava, V. K.; Gupta, G. S. R. Exp Mech 1987, 346.
25. Stevenson, A.; Priest, A. M. Rubber Chem Technol 1991, 64, 545.
26. Kim, G.; Ajersch, F. J Mater Sci 1994, 29, 676.
27. Comyn, J. In Durability of Structural Adhesives; Kinloch, J., Ed.; Applied Science: London, 1983.
28. Xiao, G. Z.; Shanahan, M. E. R. J Polym Sci Part B: Polym Phys 1997, 35, 2659.
29. Srivastava, V. K.; Hogg, P. J. J Mater Sci 1998, 33, 1129.
30. Moidu, A. K.; Sinclair, A. N.; Spelt, J. K. J Adhes 1998, 65, 239.
31. Lindberg, R. E. Sea Technol 1992, 41.
32. Srivastava, V. K. Mater Sci Eng A 1999, 263, 56.
33. Diffusion in Polymers; Crank, J.; Park, G. S., Eds.; Academic: London, 1968.