Thermal conductivity, strength and ageing behaviour of adhesive-bonded joints with filler-modified adhesives

Schweissen und Schneiden/Welding and Cutting

Volumn 50, Issue 7, 1998, Pages

  Hahn, Ortwin ^a   Meschut, Gerson ^a   Koyro, Martin ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

AGE HARDENING; ALUMINUM ALLOYS; BONDING; EPOXY RESINS; FILLERS; POLYURETHANES; POWDER METALS; SHEAR STRESS; STRENGTH OF MATERIALS; SUBSTRATES; TENSILE TESTING; THERMAL CONDUCTIVITY OF SOLIDS;

ADHESIVE-BONDED JOINTS; FILLER-MODIFIED ADHESIVES;

ADHESIVE JOINTS;

EID: 0032118247     PISSN: 00367184     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)