(001) Silicon surfacial grain boundaries obtained by direct wafer bonding process: Accurate control of the structure before bonding

Philosophical Magazine

Volumn 85, Issue 21, 2005, Pages 2415-2448

  Rousseau, K ^a   Eymery, J ^a   Fournel, F ^a   Morniroli, J P ^b   Rouviere, J L ^a  

^a CEA GRENOBLE   (France)

^b UNIV LILLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CRYSTAL STRUCTURE; CRYSTALLOGRAPHY; GRAIN BOUNDARIES; HYDROPHOBICITY; MOLECULAR DYNAMICS; SILICON WAFERS; SURFACE PHENOMENA; TRANSMISSION ELECTRON MICROSCOPY;

BONDING PROCESS; SILICON FILMS; SQUARE ARRAYS; WAFER BONDING;

THIN FILMS;

EID: 27744514081     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786430500070834     Document Type: Article

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