Reaction mechanism of the two-step MOCVD of copper thin film using Cu(hfac)2·H2O source

Electrochemical and Solid-State Letters

Volumn 8, Issue 11, 2005, Pages

  Lee, Chiapyng ^a   Lee, Hsin Hung ^a   Yen, Yee Wen ^a   Kuo, Yu Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; REACTION KINETICS;

COPPER THIN FILMS;

THIN FILMS;

EID: 27744457345     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2052050     Document Type: Article

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