A potential novel two-step MOCVD of copper seed layers

Electrochemical and Solid-State Letters

Volumn 8, Issue 1, 2005, Pages

  Lee, Chiapyng ^a   Lee, Hsin Hung ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROPLATING; ETHANOL; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; THIN FILMS; ULSI CIRCUITS; WATER; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION FILMS; METALLIC CATALYSTS; REDUCING AGENTS; THIN COPPER FILMS;

METALLORGANIC CHEMICAL VAPOR DEPOSITION;

EID: 12344324813     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1828345     Document Type: Article

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