A methodology for optimizing the selection of decoupling components for power delivery systems of high-performance ASICs

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 195-198

  Beker, Benjamin ^a   Wallace, Doug ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; FREQUENCY BANDS; RESONANT CIRCUITS;

BOARD-LEVEL; DE-COUPLING; DECOUPLING COMPONENTS; DISTRIBUTED CIRCUIT MODEL; PACKAGE LEVELS; PERFORMANCE TARGETS; POWER DELIVERY NETWORK; POWER DELIVERY SYSTEMS;

PACKAGING;

EID: 27644572604     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057914     Document Type: Conference Paper

References (4)

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2. D. J. Herrell and B. Beker, "Modeling of power distribution systems for high-performance microprocessors," IEEE Trans. Advanced Packaging, vol. 22, no. 3, pp. 240-248, Aug. 1999
3. L. D. Smith, et al, "Power plane SPICE models and simulated performance for materials and geometries," IEEE TransAdumcedpp. 277-287, vol. 24, no. 3, Aug. 2001.
4. D. Jatkar and B. Beker, "Effects of package parasitics on the performance of SAW filters," IEEE Trans. Ultrason. Ferroelect. Freq. Control, vol. 43, no. 6, pp. 1187-1194, Nov. 1996.