Effects of package parasitics on the performance of SAW filters

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 43, Issue 6, 1996, Pages 1187-1194

  Jatkar, Deepak D ^a  

^a HAL Computer Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; LUMPED PARAMETER NETWORKS; ULTRASONIC TRANSDUCERS;

BOND WIRE CONNECTIONS; CURRENT SIMULATION METHOD (CSM); INTERDIGITAL TRANSDUCERS (IDT); PACKAGE PARASITICS;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0030288225     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/58.542063     Document Type: Article

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