Ultra short pulse laser meeting the requirements for high speed and high quality dicing of low-k wafers

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2005, Pages 195-197

  Sillanpää, Jari ^a   Kangastupa, Jarno ^a   Salokatve, Arto ^a   Asonen, Harry ^a  

^a Corelase ^*  (Finland)

Author keywords

Dicing; Laser; Low k; Ultra Short Laser Pulses

Indexed keywords

CRACKS; DELAMINATION; DIAMONDS; LASERS; SAWING; SILICON WAFERS;

DICING; LOW-K; ULTRA SHORT LASER PULSES;

ULTRASHORT PULSES;

EID: 27644498922     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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