Polymer flip-chip bonding of pressure sensors on flexible kapton film for neonatal catheters

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 749-752

  Li, Chunyan ^a   Sauser, Frank E ^a   Azizkhan, Richard ^b   Ahn, Chongh ^a   Papautsky, Ian ^a  

^a University of Cincinnati   (United States)

^b CINCINNATI CHILDREN'S HOSPITAL MEDICAL CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP-CHIP BONDING; NEONATAL CATHETERS; PIEZORESISTIVE DETECTION; PRESSURE SENSORS;

ADHESIVES; ELECTRIC POTENTIAL; HEAT CONVECTION; MELTING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; SILICON WAFERS; THERMAL EFFECTS; THERMOPLASTICS;

MICROACTUATORS;

EID: 3042820696     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. J.F.L. Goosen, "Design Considerations for Silicon Sensors for Use in Catheters and Guide Wires," Smart Mater. Struct, vol. 11, pp. 804-812, 2002.
2. J. Sorrell and A. Bhattacharya, "Mounting of MEMS Sensors on Coronary Guide-Wires," University of Colorado at Boulder, 1998.
3. K. W. Oh and C. H. Ahn, " Development of an Innovative Flip-Chip Bonding Technique Using Micromachined Conductive Polymer Bumps," Proc. IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC, June 8-11, pp. 170-173, 1998.
4. K. W. Oh, C. H. Ahn and K. B. Roenker, "Flip-Chip Packaging Using Micromachined Conductive Polymer Bumps and Alignment Pedestals for MOEMS," J.Sel Top. Quantum Electron., vol. 5, pp. 119-126, 1999.
5. B. Acklin, J. Bellermann, M. Schienle, L. Stoll, M. Honsberg, and G. Muller, "Self-aligned Packaging of an Optical Switch Array with Integrated Tapers," IEEE Photon. Technol. Lett., vol. 7, pp. 406-408, 1995.
6. W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, and P. Vettiger, "Passive Self-aligned Low-cost Packaging of Semiconductor Laser Arrays on Si Motherboard," IEEE Photon. Technol. Lett., vol. 7, pp. 1324-1326, 1995.