Characterization of Parylene-assisted wafer bonding: Long-term stability and influence of process chemicals

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 2, Issue , 2005, Pages 2015-2018

  Kim, Hanseup ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Long term stability; Parylene; Wafer bonding

Indexed keywords

LONG-TERM STABILITY; PARYLENES; WAFER BONDING;

PRESSURE EFFECTS; SOLDERING; STABILITY; WSI CIRCUITS;

ELECTRONICS PACKAGING;

EID: 27544456461     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. R. Zengerle, S. Kluge, M. Richter, and A. Richter, "A bidirectional silicon micropump," MEMS '95, pp. 19-24, 1995.
2. T.-K. A. Chou, K. Najafi, M. O. Muller, L. P. Bernal, and P. D. Washabaugh, "High-density micromachined acoustic ejector array for micro propulsion," Transducers '01, pp. 890-3, 2001.
3. J. B. Lasky, "Wafer bonding for silicon -on-insulator," Appl. Phys. Lett., vol. 48, pp. 78-80, 1986.
4. H. S. Kim and K. Najafi, "Wafer bonding using Parylene and wafer-level transfer of free-standing Parylene membranes," Transducers '03, pp. 790-3.
5. H. S. Kim, K. Najafi, P. D. Washabaugh, and L. P. Bernal, "Large-deflection out-of-plane electrostatic buckled-electrode actuator," Transducers '03, pp. 794-797, 2003.
6. H.-S. Noh, K.-S. Moon, A. Cannon, P.J.Hesketh, and C. P. Wong, "Wafer bonding using microwave of heating of parylene intermediate layers," J. Micromech. Microeng., vol. 14, pp. 625-631, 2004.
7. B. Bilenberg, T. Nielsen, B. Clausen, and A. Kristensen, "PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics," Journal of Micromechanics and Microengineering, vol. 14, pp. 814-818, 2004.
8. K.W. Oh, A. Han, S. Bhansali, and C. H. Ahn, "A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems," Journal of Micromechanics and Microengineering, vol. 12, pp. 187-191, 2002.
9. A. Bayrashev and B. Ziaie, "Silicon wafer bonding with an insulator interlayer using RF dielectric heating," MEMS'02, pp. 419-422, 2002.
10. H. S. Lee, D. S. Kim, and T. H. Kwon, "A novel low temperature bonding technique for plastic substrates using X-ray irradiation," Transducers '03, pp. 1331-1334, 2003.
11. Y.-C. Su and L. Lin, "Localized plastic bonding for micro assembly, packaging and liquid encapsulation," MEMS '01, pp. 50-53, 2001.
12. Z. Hua, O. Srivannavit, Y. Xia, and E. Gulari, "A compact chemical-resistance microvalve array using Parylene membrane and pneumatic actuation," ICMENS '04, pp. 64-68, 2004.