SCOPUS 정보 검색 플랫폼

Polymer

Volumn 46, Issue 24, 2005, Pages 10831-10840

Cure profiles, crosslink density, residual stresses, and adhesion in a model epoxy

(3) Case, Sandra L a,c O'Brien, Emmett P b,d Ward, Thomas C a

a STATE UNIVERSITY (United States)

b Virginia Polytechnic Institute and State University (United States)

c Lord Coporation (United States)

d EASTMAN CHEMICAL COMPANY (United States)

Author keywords

Dilatometry; Epoxy; Moisture

Indexed keywords

ADDITION REACTIONS; ADHESION; COMPLEXATION; CROSSLINKING; CURING; DENSITY (SPECIFIC GRAVITY); DILATOMETERS; ENERGY DISSIPATION; GLASS TRANSITION; MOISTURE; PHENOLS; RESIDUAL STRESSES;

1,4-BUTANEDIOL; 4-METHYL-2-PHENYL IMIDAZOLE; CROSSLINK DENSITY;

EPOXY RESINS;

POLYMER SCIENCE;

EID: 27444441315 PISSN: 00323861 EISSN: None Source Type: Journal
DOI: 10.1016/j.polymer.2005.09.053 Document Type: Article

Times cited : (37)

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