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Volumn 39, Issue 7, 2001, Pages 796-810

Analysis of dimensionally stable copolyimide with a low-level residual stress

Author keywords

Copolyimide; Morphological factors; Residual stress; Stress relaxation

Indexed keywords

COPOLYMERS; CRYSTALLINE MATERIALS; CURING; ENCAPSULATION; RESIDUAL STRESSES; STRESS RELAXATION; STRESS RELIEF; THERMAL EXPANSION; THERMOANALYSIS; X RAY DIFFRACTION ANALYSIS;

EID: 0035312865     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/1099-0488(20010401)39:7<796::AID-POLB1054>3.0.CO;2-W     Document Type: Article
Times cited : (14)

References (36)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.