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Volumn 39, Issue 7, 2001, Pages 796-810
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Analysis of dimensionally stable copolyimide with a low-level residual stress
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Author keywords
Copolyimide; Morphological factors; Residual stress; Stress relaxation
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Indexed keywords
COPOLYMERS;
CRYSTALLINE MATERIALS;
CURING;
ENCAPSULATION;
RESIDUAL STRESSES;
STRESS RELAXATION;
STRESS RELIEF;
THERMAL EXPANSION;
THERMOANALYSIS;
X RAY DIFFRACTION ANALYSIS;
CHAIN ORIENTATION;
CHAIN RIGIDITY;
PRISM COUPLERS;
POLYIMIDES;
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EID: 0035312865
PISSN: 08876266
EISSN: None
Source Type: Journal
DOI: 10.1002/1099-0488(20010401)39:7<796::AID-POLB1054>3.0.CO;2-W Document Type: Article |
Times cited : (14)
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References (36)
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