Tensile properties and fatigue crack growth in LIGA nickel MEMS structures

Materials Science and Engineering: A

Volumn 406, Issue 1-2, 2005, Pages 274-278

  Son, Dongil ^a   Kim, Jong Jin ^a   Kim, Ju Young ^a   Kwon, Dongil ^a  

^a Seoul National University   (South Korea)

Author keywords

Crack propagation rate; Cycles to failure; Fatigue; LIGA nickel; MEMS; Microtensile

Indexed keywords

BRITTLENESS; CRACK PROPAGATION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; HARDNESS; MICROELECTROMECHANICAL DEVICES; STRAIN; STRESS INTENSITY FACTORS; STRESSES; TENSILE PROPERTIES; TENSILE STRENGTH; TENSILE TESTING;

CRACK PROPAGATION RATE; FATIGUE CRACK GROWTH; FATIGUE DEVICE; MICROTENSILE DEVICE;

NICKEL;

FATIGUE;

EID: 26944463417     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.06.044     Document Type: Article

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