New aqueous clean for aluminum interconnects: Part II. applications

Solid State Phenomena

Volumn 76-77, Issue , 2001, Pages 51-54

  Ravikumar, R ^a   Rath, D L ^b   Delehanty, D J ^c   Filippi, R G ^c   Kiewra, E W ^c   Stojakovic, G ^a   McCullough, K J ^c   Miura, D D ^c   Gambino, J ^c   Schnabel, F ^a   Rhoads, B N ^c  

^a INFINEON TECHNOLOGIES   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

Post Al RIE clean; Reliability; Via clean

Indexed keywords

RELIABILITY;

ALUMINUM INTERCONNECTS; BACK END OF LINES; INTERCONNECT TECHNOLOGY;

ALUMINUM;

EID: 26144462788     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.76-77.51     Document Type: Conference Paper

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