Determining thermal expansion coefficient of stressed thin films at low temperature

Polymer Testing

Volumn 24, Issue 7, 2005, Pages 839-843

  Wang, Zheng Dao ^a   Zhao, Xin Xin ^a   Jiang, Shao Qing ^a   Lu, Jian Jun ^a  

^a BEIJING JIAOTONG UNIVERSITY   (China)

Author keywords

Coefficient of thermal expansion; Low temperature; Stress; Thin film

Indexed keywords

CRYOGENICS; DESIGN; LOW TEMPERATURE EFFECTS; STRESSES; THERMAL EXPANSION;

CO-EFFICIENT OF THERMAL EXPANSION; CRYOGENIC ENGINEERING; CRYOGENIC TEMPERATURE; STRESS LEVELS;

THIN FILMS;

EID: 25644444569     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2005.06.014     Document Type: Article

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