Microstructural modification of nc-Si/SiO x films during plasma-enhanced chemical vapor deposition

Physica Status Solidi (A) Applications and Materials Science

Volumn 202, Issue 9, 2005, Pages 1773-1777

  Zhang, X W ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FILM MATRIX; POST-HEAT TREATMENT; SILICA NETWORK; SILICON OXIDE FILMS;

HIGH RESOLUTION ELECTRON MICROSCOPY; INFRARED RADIATION; MICROSTRUCTURE; MODIFICATION; NANOSTRUCTURED MATERIALS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THIN FILMS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

SILICON COMPOUNDS;

EID: 25444437499     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200420046     Document Type: Article

References (12)

1. L. T. Canham, Appl. Phys. Lett. 57, 1046 (1990).
2. V. Lehmann and U. Gosele, Appl. Phys. Lett. 58, 856 (1991).
3. Z. Ma, L. Wang, K. Chen, W. Li, L. Zhang, Y. Bao, X. Wang, J. Xu, X. Huang, and D. Feng, J. Non-Cryst. Solids 299, 648 (2002).
4. D. J. Lockwood, A. H. Lu, and J. M. Baribean, Phys. Rev. Lett. 76, 539 (1996).
5. L. Pavesi, L. Negro, C. Mazzoleni, G. Franzo, and F. Priolo, Nature 408, 440 (2000).
6. A. G. Nassiopoulou, V. Ioannou-Sougleridis, P. Photopoulos, A. Travlos, V. Tsakiri, and D. Papadimitriou, phys. stat. sol. (a) 165, 79 (1998).
7. P. Photopoulos, A. G. Nassiopoulou, D. N. Kouvatsos, and A. Travlos, Mater. Sci. Eng. B 69, 345 (2000).
8. F. Rochet, G. Dufour, and H. Roulet, Phys. Rev. B 37, 6468 (1988).
9. D. W. Cooke, B. L. Bennett, and E. H. Farnum, Appl. Phys. Lett. 68, 1663 (1996).
10. B. H. Augustine, E. A. Irene, and Y. J. He, J. Appl. Phys. 78, 4020 (1995).
11. W. Q. Man, G. R. Man, Z. S. Ding, S. Wei, and Z. Mao, J. Zhang, Chin. Sci. Bull. 41, 1139 (1996).
12. E. T. Trene, J. Electrochem. Soc. 127, 705 (1980).