Extremely compact (0.3 cm3) 40 Gbit/s optical receiver module with ease-of-use receptacle interface and feedthrough launcher

Electronics Letters

Volumn 40, Issue 9, 2004, Pages 557-558

  Fukatsu, K ^a   Takeuchi, T ^a   Shiba, K ^a   Makita, K ^a   Amamiya, Y ^a   Suzuki, Y ^a   Kato, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMPEDANCE; ENERGY DISSIPATION; MODULATORS; MULTIMEDIA SYSTEMS; SIGNAL RECEIVERS; SUBSTRATES;

BIT ERROR RATE (BER); COPLANAR WAVEGUIDES (CPW); OPTICAL NETWORK SYSTEMS; TRANSIMPEDANCE AMPLIFIER;

FIBER OPTIC NETWORKS;

EID: 2542465129     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20040373     Document Type: Article

References (6)

1. Iwasaki, N., Yanagibashi, M., Tsunetsugu, H., Kato, K., Ishitsuka, F., Hosoya, M., and Kikuchi, H.: 'Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface', IEEE Trans. Adv. Packag., 2001, 24, (4), pp. 429-433
2. Takeyari, R., Watanabe, K., Shirai, M., Tanoue, T., Masuda, T., and Washio, K.: 'Fully monolithically integrated 40-Gbit/s transmitter and receiver'. Optical Fiber Communication Conf. 2001, Vol. 3, WO1-1-WO1-3
3. Bitter, M., Bauknecht, R., Hunziker, W., and Melchior, H.: 'Monolithic InGaAs-InP p-i-n/HBT 40-Gb/s optical receiver module', IEEE Photonics Technol. Lett., 2000, 12, (1), pp. 74-76
4. Miyamoto, Y., Yoneyama, M., Imai, Y., Kato, K., and Tsunetsugu, H.: '40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection', Electron. Lett., 1998, 34, (5), pp. 493-494
5. Takeuchi, T., Nakata, T., Makita, K., and Torikai, T.: 'High-power and high-efficiency photodiode with an evanescently coupled graded-index waveguide for 40 Gbit/s applications'. Optical Fiber Communication Conf. 2001, WQ2-1
6. Amamiya, Y., Suzuki, Y., Kawanaka, M., Hosoya, K., Yamazaki, Z., Mamada, M., Takahashi, H., Wada, S., Kato, T., Ikenaga, Y., Tanaka, S., Takeuchi, T., and Hida, H.: '40-Gb/s optical receiver IC chipset including a transimpedance amplifier, a differential amplifier, and a decision circuit - using GaAs-based HBT technology', IEEE MTT-S Microw. Symp. Dig., 2002, 1, (2-7), pp. 87-90