40Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

Electronics Letters

Volumn 34, Issue 5, 1998, Pages 493-494

  Miyamoto, Y ^a   Yoneyama, M ^a   Imai, Y ^a   Kato, K ^a   Tsunetsugu, H ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED OPTOELECTRONICS; OPTICAL WAVEGUIDES; PHOTODIODES; SOLDERING;

OPTICAL RECEIVER MODULES;

PHOTODETECTORS;

EID: 0032485143     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19980337     Document Type: Article

References (5)

1. TSUDA, H., MIYAMOTO, Y., SANO, A., KATO, K., IMAI, Y., and HAGIMOTO, K.: '40Gbit/s baseband-type optical receiver module using a waveguide photodetector and a GaAs MESFET distributed amplifier IC'. OECC'97 Tech. Dig., 1996, Paper 19A1-2, pp. 506-507
2. KIMURA, S., and IMAI, Y.: 'DC-to-40GHz GaAs MESFET distributed baseband amplifier IC'. APMC'94 Tech. Dig., 1994, Vol. 1, pp. 249-252
3. KATO, K., HATA, S., KUWANO, K., YOSHIDA, J., and KOZEN, A.: 'A high-efficiency 50GHz InGaAs multimode waveguide photodetector', J. Quantum. Electron., 1992, 28, pp. 2728-2735
4. TSUNETSUGU, H., HAYASHI, T., HOSOYA, M., and KATSURA, K.: 'New flip-chip bonding technique using transferred microsolder bumps'. 1st IEMT/IMC Symp., 1997, pp. 56-61
5. YONEYAMA, M., SANO, A., HAGIMOTO, K., OTSUJI, T., MURATA, K., IMAI, Y., YAMAGUCHI, S., ENOKI, T., and SANO, E.: 'A 40Gbit/s optical receiver circuit using InAlAs/InGaAs HEMT Digital IC chip set'. Paper WE1D-2, MTT-S'97 Tech. Dig., 1997, pp. 461-462