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Volumn 3, Issue 2, 2004, Pages 322-331

Optimization of sub-100-nm designs for mask cost reduction

Author keywords

Critical dimensional budget; Cycle time; Design optimization; Device parameter extraction; Integrated simulation; Mask cost; Optical proximity correction; Sub 100 nm process

Indexed keywords

CRITICAL DIMENSIONAL BUDGET; CYCLE TIME; DEVICE PARAMETER EXTRACTION; INTEGRATED SIMULATION; MASK COST; OPTICAL PROXIMITY CORRECTION; SUB-100 NM PROCESS;

EID: 2542463397     PISSN: 15371646     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.1668275     Document Type: Article
Times cited : (31)

References (22)
  • 1
    • 0000793139 scopus 로고
    • Cramming more components onto integrated circuits
    • G. E. Moore, "Cramming more components onto integrated circuits," Electronics 38(8), 114-117 (1965).
    • (1965) Electronics , vol.38 , Issue.8 , pp. 114-117
    • Moore, G.E.1
  • 3
    • 2542432829 scopus 로고    scopus 로고
    • K. Kimmel, in Ref. 2, pp. 225-230
    • K. Kimmel, in Ref. 2, pp. 225-230.
  • 4
  • 5
    • 2542428198 scopus 로고    scopus 로고
    • Simulation study of the 193 nm lithography: An evaluation of subwavelength photomasks using Monte Carlo simulation
    • L. Karklin, "Simulation study of the 193 nm lithography: An evaluation of subwavelength photomasks using Monte Carlo simulation," Proceedings of Photomask Japan, 2002, p. 103.
    • (2002) Proceedings of Photomask Japan , pp. 103
    • Karklin, L.1
  • 6
    • 2542440396 scopus 로고    scopus 로고
    • Solutions for balancing price and cycle time in subwavelength era mask sets
    • San Jose, CA, 25 June
    • M. Harris, "Solutions for balancing price and cycle time in subwavelength era mask sets," 8th Annual Advanced Reticle Symposium, San Jose, CA, 25 June 2002.
    • (2002) 8th Annual Advanced Reticle Symposium
    • Harris, M.1
  • 20
    • 0037326127 scopus 로고    scopus 로고
    • Material removal regions in chemical mechanical planarization for submicron integrated circuit fabrication: Coupling effects of slurry chemicals, abrasive size distribution, and wafer-pad contact area
    • J. Luo and D. A. Dornfeld, "Material removal regions in chemical mechanical planarization for submicron integrated circuit fabrication: Coupling effects of slurry chemicals, abrasive size distribution, and wafer-pad contact area," IEEE Trans. Semicond. Manuf. 16(1), 45-56 (2003).
    • (2003) IEEE Trans. Semicond. Manuf. , vol.16 , Issue.1 , pp. 45-56
    • Luo, J.1    Dornfeld, D.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.