-
2
-
-
0016655298
-
Capacitance models for integrated circuit metalization wires
-
A.Ruehli P.Brennan "Capacitance Models for Integrated Circuit Metalization Wires "Journal of Solid-State Integrated Circuits Vol.10 No.6 pp.530-536 1975.
-
(1975)
Journal of Solid-state Integrated Circuits
, vol.10
, Issue.6
, pp. 530-536
-
-
Ruehli, A.1
Brennan, P.2
-
3
-
-
0008405647
-
A multilevel parasitic interconnect capacitance modeling and extraction for reliable VLSI On-chip clock delay evaluation
-
M.Lee "A Multilevel Parasitic Interconnect Capacitance Modeling and Extraction for Reliable VLSI On-Chip Clock Delay Evaluation" Journal of Solid-State Integrated Circuits Vol.33 No.4 pp.657-661 1998.
-
(1998)
Journal of Solid-state Integrated Circuits
, vol.33
, Issue.4
, pp. 657-661
-
-
Lee, M.1
-
4
-
-
0023963696
-
Line-to-ground capacitance calculation for VLSI: A comparison
-
E.Barke "Line-to-Ground Capacitance Calculation for VLSI: A Comparison" IEEE Transaction of Computer Added Design Vol.7 No.2 pp. 295-298 1988
-
(1988)
IEEE Transaction of Computer Added Design
, vol.7
, Issue.2
, pp. 295-298
-
-
Barke, E.1
-
6
-
-
2942654712
-
Calculating wire capacitance in integrated circuits
-
O.P.Jensen "Calculating Wire Capacitance in Integrated Circuits" IEEE Circuits and Devices No.3 pp.36-40 1994.
-
(1994)
IEEE Circuits and Devices
, Issue.3
, pp. 36-40
-
-
Jensen, O.P.1
-
7
-
-
0000325641
-
Effect of scaling of interconnections on the time delay of VLSi circuits
-
K.C.Saraswat F.Mohammadi Effect of Scaling of Interconnections on the Time Delay of VLSi Circuits Journal of Solid-State Circuits Vol.17 No.2 pp.275-280, 1982.
-
(1982)
Journal of Solid-state Circuits
, vol.17
, Issue.2
, pp. 275-280
-
-
Saraswat, K.C.1
Mohammadi, F.2
-
8
-
-
0020704286
-
Simple formulas for two- and three -dimensional capacitances
-
T. Sakurai K. Tamaru Simple Formulas for Two- and Three -Dimensional Capacitances IEEE Tran. On Electron Devices Vol.30 No.2 pp.183-185, 1983.
-
(1983)
IEEE Tran. on Electron Devices
, vol.30
, Issue.2
, pp. 183-185
-
-
Sakurai, T.1
Tamaru, K.2
-
9
-
-
0026626371
-
Multilevel metal capacitance models for CAD design synthesis systems
-
J.H. Chern, J. Huang, L. Arledge, P.C. Li, and P. Yang, Multilevel metal capacitance models for CAD design synthesis systems, IEEE Electron Device Letters, Vol.13, pp. 32-34, 1992.
-
(1992)
IEEE Electron Device Letters
, vol.13
, pp. 32-34
-
-
Chern, J.H.1
Huang, J.2
Arledge, L.3
Li, P.C.4
Yang, P.5
-
10
-
-
0033699979
-
An empirical three-dimensional crossover capacitance model for multilevel interconnect VLSI circuits
-
Shyh-Chyi Wong T.G.Y.Lee D.J.Ma CH.J.Chao An Empirical Three-Dimensional Crossover Capacitance Model for Multilevel Interconnect VLSI Circuits IEEE Trans. Semiconductor Manufacxturing Vol.13 No.2 pp.219-223, 2000.
-
(2000)
IEEE Trans. Semiconductor Manufacxturing
, vol.13
, Issue.2
, pp. 219-223
-
-
Wong, S.-C.1
Lee, T.G.Y.2
Ma, D.J.3
Chao, Ch.J.4
-
11
-
-
84861254321
-
-
Vector Fields http://www.vectorfields.com/op2d
-
-
-
-
13
-
-
0034315408
-
Compact distributed RLC interconnect models, part II- Coupled line transient expressions and peak crosstalk in multilevel networks
-
J.A.Davis J.D.Meindl "Compact Distributed RLC Interconnect Models, Part II- Coupled line transient expressions and peak crosstalk in multilevel networks" IEEE Transactions on Electron Devices Vol.47 No.11 pp.2078-2087 2000.
-
(2000)
IEEE Transactions on Electron Devices
, vol.47
, Issue.11
, pp. 2078-2087
-
-
Davis, J.A.1
Meindl, J.D.2
-
15
-
-
0019603042
-
A two-dimensional simulations of LSI interconnect capacitance
-
Aug
-
R.L Dang N.Shigyo A two-dimensional simulations of LSI interconnect capacitance IEEE Electron Device Lett. EDL-2 pp.196-197, Aug 1981.
-
(1981)
IEEE Electron Device Lett. EDL-2
, pp. 196-197
-
-
Dang, R.L.1
Shigyo, N.2
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