Analysis of via discontinuity

Microwave and Optical Technology Letters

Volumn 39, Issue 4, 2003, Pages 290-295

  Chen, Houfei ^a   Huang, Chung Chi ^a   Tsang, Leung ^a,b   Li, Qin ^a  

^a University of Washington   (United States)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Interconnect; Packaging; Via discontinuity

Indexed keywords

APPROXIMATION THEORY; ELECTROMAGNETIC WAVE PROPAGATION; MATHEMATICAL MODELS; WAVEFORM ANALYSIS;

FULL WAVE MODELING; THIN WIRE APPROXIMATION; VIA DISCONTINUITY;

MICROWAVES;

EID: 0142217325     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.11194     Document Type: Article

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