Agilent technologies' singlemode small form factor (SFF) module incorporates micromachined silicon, automated passive alignment, and non-hermetic packaging to enable the next generation of low-cost fiber optic transceivers

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 182-187

  Owen, Martyn ^a  

^a AGILENT TECHNOLOGIES   (United Kingdom)

Author keywords

Automated passive alignment; Fiberoptic transceiver; Non hermetic packaging; Silicon optical bench; Singlemode small form factor

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROOPTICAL DEVICES; SEMICONDUCTING SILICON; SEMICONDUCTOR LASERS; SEMICONDUCTOR QUANTUM WELLS; SILICONES; SINGLE MODE FIBERS;

AUTOMATED PASSIVE ALIGNMENT; FIBER OPTIC TRANSCEIVERS; MICROMACHINED SILICON; NON HERMETIC PACKAGING; PRECISION DIE ATTACH EQUIPMENT; SILICON OPTICAL BENCH TECHNOLOGY; SINGLEMODE MODULE DESIGN; SMALL FORM FACTOR MODULE;

TRANSCEIVERS;

EID: 0033701894     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846631     Document Type: Article

References (4)

1. K. A. Cooper, "Flip chip equipment for high end electro-optic modules," in Proc. 48th Electron. Comp. Technol., May 1998, pp. 176-179.
2. A. McGhee, "New fiber-optic devices demand new manufacturing processes," Lightwave Special Rep.-Syst. Subsyst., pp. 107-110, Sept. 1998.
3. Sutherland etal., "The reliability of planar InGaAs/InP PIN photodiodes with organic coatings for use in low cost receivers," Proc. SPIE, vol. 1174, 1989.
4. Bellcore Technical Advisory, Reliability assurance protection for optoelectronic devices in loop applications, Tech. Rep. TA NWT 000 983, no. 2, Dec. 1993.