Flip-chip packaging reliability advances

Advanced Packaging

Volumn 9, Issue 6, 2000, Pages 39-X1

  Alcoe, David ^a   Blackwell, Kim ^a   Laine, Eric ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; FLIP CHIP MULTILAYER CERAMIC PACKAGES;

FLIP CHIP DEVICES; MULTILAYERS; SUBSTRATES; THERMAL EXPANSION; THIN FILM CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0034197332     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)