High Reliability BGA Package Improvements on Module Total Cost of Ownership

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 279-284

  Alcoe, David J ^a   Blackwell, Kim J ^a   Rai, Rajinder ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COSTS; DIES; RELIABILITY; AVAILABILITY; CHIP SCALE PACKAGES; COPPER; ELECTRIC WIRING; ELECTRONICS PACKAGING; INDUSTRIAL ELECTRONICS; MANUFACTURE; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES; SOLDERED JOINTS; STEEL;

BALL GRID ARRAYS;

ELECTRONICS PACKAGING; COSTS;

ASSEMBLY SYSTEMS; CERAMICS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; FLIP CHIP; SEMICONDUCTOR DEVICE PACKAGING;

EID: 0141565360     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. D. J. Alcoe, et al, "A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier," Semiconductor Packaging Technologies Symposium, SEMICON WEST 99, San Jose, CA, July 1999.
2. D. J. Alcoe, et al, "Qualification Results of HyperBGA, IBM's High Performance Flip Chip Organic BGA Chip Carrier," Semiconductor Package Technologies Symposium, SEMICON WEST 2000, San Jose, CA, July 2000.
3. D. J. Alcoe, et al, "Flip Chip Packaging Reliability Advances, " Advanced Packaging, pp39-46, June/July 2000.