Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2001, Pages 533-536

  Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BANDWIDTH; CHIP SCALE PACKAGES; COPPER; DIELECTRIC MATERIALS; FLIP CHIP DEVICES; MICROSTRIP LINES; MULTICHIP MODULES; PERMITTIVITY; THIN FILMS; THREE DIMENSIONAL; VLSI CIRCUITS;

MULTILAYER THIN FILM TECHNOLOGY; THIN FILM MULTICHIP MODULES; ULTRA THIN CHIP STACKING TECHNOLOGY; VLSI TECHNOLOGY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0035714371     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Overview and development trends in the field of MEMS packaging
2. Interchip via technology for vertical system integration
3. Issues and opportunities in thin film MCM
4. Residual thermomechanical stresses in thinned chip assemblies
5. Thermal management in new ultra-thin chip stack technology