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Volumn , Issue , 2004, Pages 793-799

Design for standard impact pulses of drop tester using dynamic simulation

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; NUMERICAL METHODS; PRINTED CIRCUIT BOARDS; TELECOMMUNICATION EQUIPMENT;

EID: 24644482382     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (15)

References (23)
  • 4
    • 0037481005 scopus 로고    scopus 로고
    • JEDEC Standard JESD22-B104-B
    • JEDEC Standard JESD22-B104-B, Mechanical Shock, 2001.
    • (2001) Mechanical Shock
  • 6
    • 1242328797 scopus 로고    scopus 로고
    • Estimation of fall impact strength for BGA solder joints
    • Japan
    • Sogo, T. and Hara, S., "Estimation of Fall Impact Strength for BGA Solder Joints," ICEP Conference Proc., Japan, 2001, pp. 369-373.
    • (2001) ICEP Conference Proc. , pp. 369-373
    • Sogo, T.1    Hara, S.2
  • 7
    • 0036134475 scopus 로고    scopus 로고
    • Effect of the drop impact on BGA/CSP package reliability
    • Mishiro, K., "Effect of the Drop Impact on BGA/CSP Package Reliability," Microelectronics Reliability Journal, 2002, Vol. 42(1), pp. 77-82.
    • (2002) Microelectronics Reliability Journal , vol.42 , Issue.1 , pp. 77-82
    • Mishiro, K.1
  • 10
    • 3843066664 scopus 로고    scopus 로고
    • Novel numerical and experimental analysis of dynamic responses under board level drop test
    • Tee, T.Y., Luan, J.E., Pek, E., Lim, C.T., and Zhong, Z.W., "Novel Numerical and Experimental Analysis of Dynamic Responses under Board Level Drop Test," EuroSime Conference Proc., 2004, pp. 133-140.
    • (2004) EuroSime Conference Proc. , pp. 133-140
    • Tee, T.Y.1    Luan, J.E.2    Pek, E.3    Lim, C.T.4    Zhong, Z.W.5
  • 13
    • 2942747236 scopus 로고    scopus 로고
    • Board level drop test and simulation of QFN packages for telecommunication applications
    • Japan
    • Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., and Zhong, Z.W., "Board Level Drop Test and Simulation of QFN Packages for Telecommunication Applications," ICEP Conference Proc., Japan, 2003, pp. 221-226.
    • (2003) ICEP Conference Proc. , pp. 221-226
    • Tee, T.Y.1    Ng, H.S.2    Lim, C.T.3    Pek, E.4    Zhong, Z.W.5
  • 14
    • 2942740958 scopus 로고    scopus 로고
    • Impact life prediction modeling of TFBGA packages under board level drop test
    • Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., and Zhong, Z.W., "Impact Life Prediction Modeling of TFBGA Packages under Board Level Drop Test," Microelectronics Reliability Journal, 2004, Vol. 44(7), pp. 1131-1142.
    • (2004) Microelectronics Reliability Journal , vol.44 , Issue.7 , pp. 1131-1142
    • Tee, T.Y.1    Ng, H.S.2    Lim, C.T.3    Pek, E.4    Zhong, Z.W.5
  • 17
    • 84954039444 scopus 로고    scopus 로고
    • Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test
    • Singapore
    • th EPTC Conference Proc., Singapore, 2003, pp. 210-216
    • (2003) th EPTC Conference Proc. , pp. 210-216
    • Tee, T.Y.1    Ng, H.S.2    Zhong, Z.W.3
  • 18
    • 3843113612 scopus 로고    scopus 로고
    • Integrated modeling and testing of fine-pitch CSP under board level drop test, bend test, and thermal cycling test
    • Japan
    • Tee, T.Y., Ng, H.S., Luan, J.E., Yap, D., Loh, K. Pek, E., Lim, CT., and Zhong, Z.W., "Integrated Modeling and Testing of Fine-pitch CSP under Board Level Drop Test, Bend Test, and Thermal Cycling Test," ICEP Conference Proc., Japan, 2004, pp. 35-40.
    • (2004) ICEP Conference Proc. , pp. 35-40
    • Tee, T.Y.1    Ng, H.S.2    Luan, J.E.3    Yap, D.4    Loh, K.5    Pek, E.6    Lim, C.T.7    Zhong, Z.W.8
  • 19
    • 24644510360 scopus 로고    scopus 로고
    • Effects of impact pulse on dynamic responses and solder joint reliability of TFBGA packages during board level drop test
    • Malaysia, December
    • th EMAP Conference Proc., Malaysia, December, 2004.
    • (2004) th EMAP Conference Proc.
    • Luan, J.E.1    Tee, T.Y.2
  • 21
    • 28444485039 scopus 로고    scopus 로고
    • Analytical and numerical analysis of impact pulse parameters on consistency of drop impact results
    • Singapore, December
    • th EPTC Conference Proc., Singapore, December, 2004.
    • (2004) th EPTC Conference Proc.
    • Luan, J.E.1    Tee, T.Y.2
  • 22
    • 28444453001 scopus 로고    scopus 로고
    • Novel board level drop test simulation using implicit transient analysis with input-G method
    • Singapore, December
    • th EPTC Conference Proc., Singapore, December, 2004.
    • (2004) th EPTC Conference Proc.
    • Luan, J.E.1    Tee, T.Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.