Analytical and numerical analysis of impact pulse parameters on consistency of drop impact results

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 664-670

  Luan, Jing En ^a   Tee, Long Yan ^a  

^a TMicroelectronics   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; SOLDERED JOINTS;

DROP IMPACT; ELECTRONIC PRODUCTS; PULSE DURATION; SOLDER JOINT PEELING;

ELECTRONICS PACKAGING;

EID: 28444485039     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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