Embedded passives technology for Bluetooth application in multi-layer printed wiring board (PWB)

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 1124-1128

  Weng, Ching Liang ^a   Wei, Pel Shen ^a   Wu, Chun Kun ^a   Chen, Chang Sheng ^a   Jow, Uei Ming ^a   Lai, Ying Jiunn ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUCTORS; ELECTRIC WIRING; ELECTRODES; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; PASSIVE NETWORKS; PERMITTIVITY;

BLUETOOTH SYSTEM; EMBEDDED PASSIVE (EP) TECHNOLOGY; PRINTED WIRING BOARD (PWB);

PRINTED CIRCUIT BOARDS;

EID: 10444258915     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2004.1319482     Document Type: Conference Paper

References (8)

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4. M.F. Davis, S.W. Yoon, S. Mandal, etc, "RF-Microwave Multi-band Design Solution for Multilayer Organic System on Package Integrated Passives," in Microwave Symposium Digest, 2002 IEEE MTT-S International, Volume: 3, 2-7 June 2002, pp.2217-2220.
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6. Barrie Jones, Isao Morooka, "Guidelines of Successful Implementation of Embedded Passive Technology," IPC Printed Circuits Expo 2003, S15-2-1.
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8. Li Li, p. Bowles, L.T. Hwang, S. Plager, "Embedded Passives in Organic Substrate for Bluetooth Transceiver Module," Electronic Components and Technology Conference, 2003.