Embedded capacitors technology in 2.4 GHz power amplifier with multi-layer printed wiring board (PWB) process

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 348-355

  Chen, Chang Sheng ^a   Liu, Shur Fen ^a   Wu, Chun Kun ^a   Wei, Pel Shen ^a   Weng, Ching Lian ^a   Jow, Uei Ming ^a   Lai, Ying Jiunn ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITORS; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; MODIFIED ATMOSPHERE PACKAGING; POWER AMPLIFIERS; PRINTED CIRCUIT BOARDS; PROGRAMMABLE LOGIC CONTROLLERS; RECONFIGURABLE HARDWARE; SURFACE MOUNT TECHNOLOGY; SYSTEM-IN-PACKAGE; SYSTEM-ON-CHIP;

APPLICATION FIELDS; ELECTRICAL PARAMETER; HIGH DIELECTRIC CONSTANTS; HIGH-DENSITY INTERCONNECTION; INTEGRAL SUBSTRATE; LAMINATION PROCESS; MANUFACTURING METHODOLOGY; SYSTEM-IN-A-PACKAGE TECHNOLOGIES;

SUBSTRATES;

EID: 84966461477     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188863     Document Type: Conference Paper

References (17)

1. William J. Borland and Saul Ferguson, "Embedded Passive Components in Printed Wiring Boards," CircuiTree, March 2001, pg. 1-8.
2. Jiming Zhou, John D. Myers, and John J. Felten, "Embedded Passives Technology for PCBs: Materials, Design, and Process," NCMS project paper, http://aept.ncms.org/papers.htm, May. 2002.
3. L. K. Wu, B. C. Tseng, L. C. Liao, "Embedded Passive Components for Printed-Circuit Boards," Proceedings of international Symposium on Microelectronics, Chicago, IL, pp.499-504, 1999.
4. th Electronic Components and Technology Conf., Las Vegas, Nevada, May. 2000, pp. 183-187.
5. L. K. Wu, B. C. Tseng, L. C. Liao, "Integral Passives in Multi-dielectric Substrate," Proceedings of international Symposium on Microelectronics, Boston, pp.438-442, 2000.
6. D. I. Amey, S. J. Horowitz, "Test Characterize High-Frequency Material Properties," Microwave & RF, vol. 36, no. 8, pp. 68-80, Aug. 1997.
7. J. B. Jarvis, B. Riddle, "Dielectric Measurement of Substrates and Packaging Material," proceedings of International Conference on High Density Interconnect and Systems Packaging, Denver, CO, pp.178-181, 2000.
8. L. Martens, High-Frequency Characterization of Electronic Packaging, Kluwer Academic Publishers, Boston/Dordrecht/London, 1998.
9. M. Kirschning and R. H. Jansen, "Accurate Model for Effective Dielectric Constant of Microstrip and Validity up to Millimeter-Wave Frequencies." Electronics Lett., vol. 18, pp. 272-273, March 1982.
10. V. K. Tripathi and I. Wolff, "Perturbation Analysis and Design Equations for Open- and Closed-Ring Microstrip Resonators," IEEE Trans. Microwave Theory Tech., vol. MTT-32, pp. 405-409, Apr. 1984.
11. R. A. Pucel, D. J. Masse, and C. P. Hartwig, "Losses in Microstrip," IEEE Trans. Microwave Theory Tech., vol. MTT-16, pp. 342-350, June1968.
12. I. J. Bahl and R. Garg, "Simple and Accurate Formulas for Microstrip with Finite Strip Thickness." Proceedings IEEE, vol.65, pp.1611-1612, Nov. 1977.
13. M. Kobayashi, "A Dispersion Formula Satisfying Recent Requirements in Microstrip CAD," IEEE Trans. Microwave Theory Tech., vol. 36, pp.1246-1250, Aug. 1988.
14. G. A. Hjellen, "Including Dielectric Loss in Printed Circuit Models for Improved EMI/EMC Prediction," IEEE Trans. Electromagnetic Compatibility, vol. 39, no. 3, pp.236-246, Aug. 1997.
15. David M. Pozar, Microwave Engineering, John Wiley, 1998.
16. nd ed., Prentice-Hall, New York, 1997.
17. Randy Wu, Major Chi, Ken Wu, Fred Hyatt, and B. C. Tseng, "Buried Passive Used with Thick-Film Process on Alumina For High Frequency Applications," Proceedings of the international conference and exhibition on high density interconnect and system packaging, Santa Clara, CL, 2001.