2.4 GHz Bluetooth module with integral passives in multi-dielectric layer printed-circuit boards

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 114-118

  Wei, Pei Shen ^a   Weng, Ching Lian ^a   Chen, Chang Sheng ^a   Wu, Chun Kun ^a   Jow, Uei Ming ^a   Lai, Ying Jiunn ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BLUETOOTH; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; RECONFIGURABLE HARDWARE; SUBSTRATES;

BLUE-TOOTH MODULE; CIRCUIT PERFORMANCE; DIELECTRIC SUBSTRATES; ELECTRICAL PARAMETER; INTEGRAL PASSIVES; LAMINATION PROCESS; MATERIAL CHARACTERISTICS; PASSIVE FUNCTIONS;

DIELECTRIC MATERIALS;

EID: 24644469201     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271500     Document Type: Conference Paper

References (8)

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