A methodology for predicting failure sites and failure modes in an IC package

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 270-276

  Tay, A A O ^a   Lee, K H ^a   Zhou, W ^a   Lim, K M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Bonding; Boundary conditions; Composite materials; Electronic packaging thermal management; Failure analysis; Geometry; Integrated circuit packaging; Material properties; Reliability engineering; Thermal stresses

Indexed keywords

BONDING; BOUNDARY CONDITIONS; BOUNDARY ELEMENT METHOD; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); GEOMETRY; MATERIALS PROPERTIES; PACKAGING MATERIALS; RELIABILITY ANALYSIS; SINGULAR VALUE DECOMPOSITION; STRAIN ENERGY; STRESS CONCENTRATION; STRESSES; THERMAL STRESS;

ELECTRONIC PACKAGING THERMAL MANAGEMENTS; INTEGRATED CIRCUIT PACKAGING; INTERFACIAL DELAMINATION; RELIABILITY ENGINEERING; SINGULAR BOUNDARY; SINGULAR STRESS FIELD; SINGULAR VALUE DECOMPOSITION METHOD; STRAIN ENERGY DENSITY;

FAILURE ANALYSIS;

EID: 0009555736     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906385     Document Type: Conference Paper

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