Delamination control in electronic packaging using the energy method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 703-707

  Fan, H B ^a   Tang, H B ^a   Yuen, Matthew M F ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CRACKS; DELAMINATION; FAILURE (MECHANICAL); INTERFACES (MATERIALS); INTERFACIAL ENERGY; NUMERICAL ANALYSIS; PROBLEM SOLVING; SHEET MOLDING COMPOUNDS; STRESSES; THERMAL EXPANSION; THERMAL LOAD;

ENERGY METHOD; EPOXY MOLDING COMPOUND; INTERFACIAL DELAMINATION;

ELECTRONICS PACKAGING;

EID: 0038012655     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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