Embedded decoupling capacitor performance in high speed circuits

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1617-1622

  Wan, Lixi ^a   Markondeya Raj, P ^a   Balaraman, Devarajan ^a   Muthana, Prathap ^a   Bhattacharya, Swapan K ^a   Varadarajan, Mahesh ^a   Abothu, Isaac Robin ^a   Swaminathan, Madhavan ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL PACKAGING; EMBEDDED DECOUPLING; HIGH SPEED CIRCUITS; SWITCHING NOISE;

CAPACITANCE; CAPACITORS; ELECTRIC IMPEDANCE; ELECTRONICS PACKAGING; FREQUENCIES; SPEED; SPURIOUS SIGNAL NOISE; SURFACE MOUNT TECHNOLOGY; SWITCHING;

EMBEDDED SYSTEMS;

EID: 24644447087     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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3. Joel Peiffer, "A Novel Embedded Cap Material," PC Fab, February 2001.
4. Lee Patch, et. al., Embedded Decoupling Capacitance Project Final Report, National Center for Manufacturing Sciences Report 0091RE00, December, 2000.
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6. Leonard W. Schaper, etc. "Electrical Performance Limitations of On-package Decoupling Capacitors", IMAPS Adv. Tech. Workshop on Passive Integration, Marco Island, FL, 2005.
7. Rick Ulrich, and Len Schaper: "Decoupling Simulation for Embedded Capacitors", IMAPS Adv. Tech. Workshop on Passive Integration, Marco Island, FL, 2005.
8. Lixi Wan, Madhavan Swaminathan, and Rao Tummala: "Simulation of Switching Noise in Multi-layer Structures Using Generalized Transmission Line Equation Method," IEEE International Symposium on EMC, Symposium Record, Vol.2, Minneapolis, Aug. 2002. pp. 1026-1031.
9. Istvan Novak: "Frequency-Domain Power-Distribution Measurement, an Overview". Design Conf. East, June 2003. Boston, MA.
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