Novel embedded cap material

Printed Circuit Fabrication

Volumn 24, Issue 2, 2001, Pages

  Peiffer, Joel S ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARIUM TITANATE; CAPACITORS; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN OF SOLIDS; ELECTROMAGNETIC WAVE INTERFERENCE; EPOXY RESINS; LEAKAGE CURRENTS; MARKETING; PERMITTIVITY; PRINTED CIRCUIT BOARDS;

EMBEDDED CAPACITOR MATERIALS; PARALLEL PLATE CAPACITOR; PROCESS COMPATIBILITY;

PRINTED CIRCUIT MANUFACTURE;

EID: 3042686415     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Peiffer, J., "(NCMS EDC) Material Development Final Report," March 2000.
2. Peiffer, J., "3M C-Ply Embedded Capacitor Material" (To be published in APEX 2001 Proceedings).
3. Hubing, T., et al., "Electrical Model and Test Results for Embedded Capacitance Boards," March 2000.
4. Hubing, T., et al., "Emissions Testing of Boards with Embedded Capacitance," April 2000.
5. Li, Weiping, "Delphi Embedded Decoupling Capacitance Final Report," April 2000.