Simulation of switching noise in multi-layer structures using generalized transmission line equation method

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2002, Pages 1026-1031

  Wan, Lixi ^a   Swaminathan, Madhavan ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Generalized Transmission Line Equation; Multi layer Structure; Switching Noise

Indexed keywords

COMPUTER SIMULATION; ELECTRIC LINES; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MULTILAYERS; SWITCHING;

SWITCHING NOISES;

SPURIOUS SIGNAL NOISE;

EID: 0036382053     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Nanju Na, et al., Modeling and Transient simulation on Planes in Electronic Packages, IEEE Trans. on Advanced Packaging, Vol. 23, no. 3, August 2000. pp340-352.
2. S.W. Leung and Lixi Wan, Ground Bounce Analysis in Printed Circuit Board by Generalized Transmission Line, Symposium on EMC, Seattle, USA, 1999.
3. Lixi Wan et al., Generalized Telegraphic Equation and Its Application in Disc Grounding System, 5th Symposium on EMC, CIC, Beijing, China, 1995.
4. Sungjun Chun, et al., Modeling of simultaneous Switching Noise in High Speed Systems, IEEE Trans. on Advanced Packaging, Vol. 24,No. 2, May 2001, pp132-142.
5. Thomas Linwood Quarles, Analysis of Performance and Convergence Issues for Circuit Simulation, Memorandum No. UCB/ERL M89/42, 24 April 1989.
6. N. Na, et al. Modeling and Transient Simulation of Planes in Electronic Packages, IEEE Trans. on Comp., Packag., Manufact. Technol. B, Vol. 23, pp. 340-352,Aug. 2000.