Wafer-voltage measurement in plasma processes by means of a new probe method and an impedance monitor

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 3, 2004, Pages 1199-1204

  Kanno, Seiichiro ^a   Tanaka, Junichi ^a   Tetsuka, Tsutomu ^a   Nishio, Ryoji ^b   Yamamoto, Hideyuki ^b  

^a HITACHI LTD   (Japan)

^b HITACHI HIGH TECHNOLOGIES CORPORATION   (Japan)

Author keywords

Equivalent circuit model; Impedance monitor; Measurement; Plasma; Probe; Wafer voltage

Indexed keywords

CAPACITANCE; ELECTRIC COILS; ELECTRIC CURRENTS; ELECTRIC IMPEDANCE; ELECTRIC POTENTIAL; ELECTRODES; NATURAL FREQUENCIES; PARAMETER ESTIMATION; PERSONAL COMPUTERS; PHASE SHIFT; PLASMA ETCHING;

ELECTROSTATIC CHUCK (ESC); EQUIVALENT CIRCUIT MODEL; IMPEDANCE MONITOR (IM); WAFER-VOLTAGE;

PLASMA PROBES;

EID: 2442630642     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.1199     Document Type: Article

References (15)

1. M. Edamura and E. C. Benck: J. Vac. Sci. Technol. A 21 (2003) 470.
2. R. Patrick, S. Baldwin and N. Williams: J. Vac. Sci. Technol. A 18 (2000) 405.
3. J. W. Butterbaugh, L. D. Baston and H. H. Sawin: J. Vac. Sci. Technol. A 8 (1990) 916.
4. F. Bose, R. Patrick and H. P. Baltes: J. Vac. Sci. Technol. B 12 (1994) 2805.
5. S. Hayashi, Y. Kadogawa, T. Mon, T. Tsuji and M. Kaneko: Dry Process Symposium (1999) 185.
6. M. Kanoh, M. Yamage and H. Takada: Jpn. J. Appl. Phys. 40 (2001) 1457.
7. M. Tuda, M. Taki, K. Shintani and H. Sumitani: IEEJ-plasma-kenkyuu-kai- siryou PST-0311-23 (2003) 7 [in Japanese].
8. S. Raul and M. J. Kushner: J. Appl. Phys. 83 (1998) 5087.
9. L. D. Hartsough: Solid State Technol. 35 (1993) 87.
10. T. Watanabe, T. Kitabayashi and C. Nakayama: Jpn. J. Appl. Phys. 32 (1993) 864.
11. D. R. Wright, L. Chen, P. Federlin and K. Forbes: J. Vac. Sci. Technol. B 13 (1995) 1910.
12. J. A. Meyer, K. H. R. Kirmse, J.-S. Jenq, S. Y. Perez-Montero, H. L. Maynard, A. E. Wendt, J. W. Taylor and N. Hershkowitz: Appl. Phys. Lett. 64 (1994) 1926.
13. H. Shan, B. Y. Pu, H. Gao, K. Ke, J. Lewis, M. Welch and C. Deshpandey: J. Vac. Sci. Technol. B 14 (1996) 521.
14. M. Hopkins: United States Patent 5808415 (1998).
15. S. Kanno, K. Ikenaga, J. Tanaka, R. Nishio, T. Tetsuka and N. Tsumaki: AEC/APC Symposium XII Proceedings (2000).