Process kit and wafer temperature effects on dielectric etch rate and uniformity of electrostatic chuck

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 1, 1996, Pages 521-526

  Shan, Hongching ^a   Pu, Bryan Y ^a   Gao, Hua ^a   Ke, Kuang Han ^a   Lewis, Jenny ^a   Welch, Michael ^a   Deshpandey, Chandra ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005325257     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588507     Document Type: Article

References (12)

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