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Volumn 5276, Issue , 2004, Pages 442-450
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A novel bistable thermally actuated snap-through actuator for out of plane deflection
a a a |
Author keywords
Bistable; Bridge; Buckling; Out of plane deflection; Snap through; Two way actuation
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Indexed keywords
BOUNDARY CONDITIONS;
BUCKLING;
COMPUTER SIMULATION;
MICROELECTROMECHANICAL DEVICES;
POLYSILICON;
RESIDUAL STRESSES;
SILICON;
THERMOANALYSIS;
BISTABLE;
BRIDGE;
OUT-OF-PLANE DEFLECTION;
SNAP-THROUGH;
THERMAL MOMENT;
TWO-WAY ACTUATION;
MICROACTUATORS;
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EID: 2442623239
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.523272 Document Type: Conference Paper |
Times cited : (5)
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References (9)
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