The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 417-422

  Xiang, Yong ^a   Vlassak, Joost J ^a   Perez Prado, Maria T ^b   Tsui, Ting Y ^c   McKerrow, Andrew J ^c  

^a HARVARD UNIVERSITY   (United States)

^b DEPARTMENT OF PHYSICAL METALLURGY   (Spain)

^c TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOUNDARY LAYERS; CHEMICAL VAPOR DEPOSITION; COPPER; CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); ELASTIC MODULI; ELECTROPLATING; MICROMACHINING; PASSIVATION; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY; VACUUM; X RAY DIFFRACTION ANALYSIS; YIELD STRESS;

BURGERS VECTORS; CHEMICAL MECHANICAL PLANARIZATION (CMP); ELECTRON BACKSCATTERED DIFFRACTION (EBSD);

THIN FILMS;

EID: 2442589627     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u11.37     Document Type: Conference Paper

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