Three-dimensional simulation of microchip encapsulation process

Polymer Engineering and Science

Volumn 40, Issue 3, 2000, Pages 776-785

  Han, Ruihua ^a   Shi, Linhuo ^a   Gupta, Mahesh ^a  

^a Michigan Technological University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INCOMPRESSIBLE FLOW; SILICON WAFERS;

MICROCHIP ENCAPSULATION;

ENCAPSULATION;

EID: 0033890082     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.11207     Document Type: Article

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