Internal stress and yield strength of copper films on substrates

Chinese Physics

Volumn 14, Issue 5, 2005, Pages 1006-1010

  Zhang, Jian Min ^a   Zhang, Yan ^a   Xu, Ke Wei ^b  

^a SHAANXI NORMAL UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Copper film; Internal stress; Thermal cycle substrate curvature; X ray diffraction; Yield strength

Indexed keywords

RESIDUAL STRESSES; STEEL; SUBSTRATES; TENSILE STRENGTH; THERMAL CYCLING; THIN FILMS; X RAY DIFFRACTION ANALYSIS; YIELD STRESS;

COPPER FILMS; FILM THICKNESS; STEEL SUBSTRATES; TENSILE YIELD STRENGTH;

COPPER;

EID: 24344449080     PISSN: 10091963     EISSN: None     Source Type: Journal    
DOI: 10.1088/1009-1963/14/5/026     Document Type: Article

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