Current loadability of ICA for flip chip applications

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 144-149

  Haberland, J ^a   Pahl, B ^a   Schmitz, S ^b   Kallmayer, C ^a   Aschenbrenner, R ^b   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; AUTOMOTIVE INDUSTRY; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING;

ANISOTROPIC CONDUCTIVE ADHESIVES; AUTOMATED MEASURING SYSTEM; CURRENT CARRYING CAPABILITY; DEGRADATION TEMPERATURES; ENVIRONMENTAL TEMPERATURE; FLIP CHIP APPLICATIONS; HIGH CURRENT BEHAVIOURS; ISOTROPIC CONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 84964621972     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185657     Document Type: Conference Paper

References (10)

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10. th Adhesive Joining and Coating Technology in Electronics Manufacturing Conf. 2000, Espoo, Finland