A robust and reliable stress-induced self-assembly supporting mechanism for optical devices

Microsystem Technologies

Volumn 11, Issue 2-3, 2005, Pages 214-220

  Ho, Y P ^a   Wu, M ^a   Lin, H Y ^a   Fang, W ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BEAMS AND GIRDERS; DEFLECTION (STRUCTURES); DIELECTRIC FILMS; METALLIC FILMS; MICROMACHINING; RELIABILITY; SELF ASSEMBLY; STRESS ANALYSIS;

LOCKING COMPONENTS; RELIABILITY TEST; STRESS-INDUCED BEAMS; TIP DISPLACEMENT;

OPTICAL DEVICES;

EID: 24044461137     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0477-1     Document Type: Article

References (10)

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10. Ho Y-P; Wu M; Lin H-Y; Fang W (2002) A robust and reliable stress-induced self-assembly mechanism for optical devices, Proceeding of IEEE/LEOS Optical MEMS, Lugano, Switzerland, September, 2002, pp 131-132