Grain boundary migration in metallic interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 231-235

  Bloomfield, Max O ^a   Cale, Timothy S ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMISTIC SIMULATIONS; BOLTZMANN FACTOR; GRAIN SIZE DISTRIBUTIONS (GSD); METALLIC INTERCONNECTS;

FREE ENERGY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; THIN FILMS;

OPTICAL INTERCONNECTS;

EID: 23844519639     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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