Failure mechanisms in dielectric barriers

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 405-410

  Alers, G B ^a   Sanganeria, M ^a   Shaviv, R ^a   Kooi, G ^a   Jow, K ^a,b   Ray, G W ^a  

^a Novellus Systems   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BARRIER LAYERS; ELECTROSTATIC FORCES; INTERFACIAL ADHESION; TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB);

ADHESION; COPPER; CRACK INITIATION; DIFFUSION; ION BEAMS; LEAKAGE CURRENTS; MATHEMATICAL MODELS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY;

DIELECTRIC MATERIALS;

EID: 23844477536     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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