The size effect of the temperature dependence of the electrical resistivity in deep-submicron Cu interconnects with various low-k dielectrics

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 103-108

  Chen, F ^a   Gambino, J ^a   Sullivan, T ^a   Gill, J ^a   Li, B ^a   Meatyard, D ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; PERMITTIVITY; THERMAL EFFECTS;

CU INTERCONNECTS; INSULATION LAYERS; SCATTERING MECHANISM; TEMPERATURE DEPENDENCE;

OPTICAL INTERCONNECTS;

EID: 23844476128     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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