Impact of interfacial chemistry on adhesion and electromigration in Cu interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 189-199

  Zhou, Ying ^a   Scherban, Tracey ^a   Xu, Guanghai ^a   He, Jun ^a   Miner, Barbara ^a   Jan, Chia Hong ^a   Ott, Andrew ^a   O'Loughlin, Jennifer ^a   Ingerly, Doug ^a   Leu, Jihperng ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL OXYGEN; MATERIAL PROPERTIES; METAL CAPPING; THERMAL ANNEALING;

ADHESION; ANNEALING; CHEMICAL ANALYSIS; ELECTROMIGRATION; INTERCONNECTION NETWORKS; SECONDARY ION MASS SPECTROMETRY; SURFACE CHEMISTRY; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 23844458272     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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