Correlation between stress relaxation and electromigration in Cu/low k lines

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 313-318

  Gan, Dongwen ^a,b   Yoon, Scan ^a,b   Ho, Paul S ^a,b   Leu, Jihperng ^a,b   Maiz, Jose ^a,b   Scherban, Tracey ^a,b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION CHARACTERISTICS; CARBON DOPED OXIDE (CDO); INTERFACIAL MASS TRANSPORT; LOW K LINES;

ADHESION; ELECTROMIGRATION; ELECTROPLATING; SEMICONDUCTOR DOPING; STRESS RELAXATION; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 23844500018     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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